3D IC Stacking Technology

Autor*innen

• Banqiu Wu

Parameter

• 521 Seiten
• 19 Lesestunden

• Elektrotechnik
• Technik & Maschinenbau

Mehr zum Buch

Chapter 1. Introduction to High-Density Through Silicon Stacking Technology§Chapter 2. A Practical Design Eco-System for Heterogeneous 3D IC Products§Chapter 3. Design Automation and TCAD Tool Solutions for Through Silicon Via-Based 3D IC Stack§Chapter 4. Process Integration for TSV Manufacturing§Chapter 5. High-Aspect-Ratio Silicon Etch for TSV§Chapter 6. Dielectric Deposition for Through Silicon Vias§Chapter 7. Barrier and Seed Deposition§Chapter 8. Copper Electrodeposition for TSV§Chapter 9. Chemical Mechanical Polishing for TSV§Chapter 10. Temporary and Permanent Bonding§Chapter 11. Assembly and Test Aspects of TSV Technology§Index

• Sprache: Englisch
• Erscheinungsdatum: 2011
• Einband: Hardcover