Power Electronic Packaging

Design, Assembly Process, Reliability and Modeling

Autor*innen

• Yong Liu

Parameter

• 612 Seiten
• 22 Lesestunden

• Elektrotechnik
• Natur
• Natur, Tiere

Mehr zum Buch

Focusing on power electronic packaging, this comprehensive guide explores key topics such as design, assembly, reliability, and failure analysis. It also emphasizes materials selection and incorporates advanced simulation and modeling techniques, making it an essential resource for professionals and researchers in the field.

• Sprache: Englisch
• Erscheinungsdatum: 2012
• Einband: Hardcover