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Focusing on advanced semiconductor technologies, this book delves into the intricacies of flip chip, hybrid bonding, and fan-out techniques. It emphasizes engineering practices while covering essential topics like wafer bumping, assembly processes, and reliability. Key discussions include chip-to-wafer bonding, various packaging methods such as WLCSP and FOWLP, and the integration of optics with chiplets. The comprehensive approach provides valuable insights into both the theoretical principles and practical applications in the field of electronics manufacturing.
Buchkauf
Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology, John H. Lau
- Sprache
- Erscheinungsdatum
- 2024
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- (Hardcover)
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